Chip Module Encapsulated Conductive Foam Of Fabric

Product Detail

Chip module encapsulated conductive foam of fabric

Product Introduction:

The flame retardant sponge is wrapped with conductive cloth, and after a series of processing, it has good surface conductivity, and can be easily fixed on the shield device with adhesive tape. Its material is very light, can have electromagnetic shielding performance, leading products anti-static performance, both permanent. Conductive fabric foam has good corrosion resistance and oxidation resistance of the two properties.

Thalez Technologies Group’s products fully meet the optoelectronis, microelectronics, aviation, aerospace, communications, military, chemical and other high-tech enterprises on the new anti-static materials needs.

 

Features And Advantages:

?Excellent vertical conductivity and shielding effect

?High bonding strength and good resilience

?Overall soft and good stickiness

?Die cutting into different shapes to use according to design requirements

?Meet ROHS,Halogen,Reach and UL94 flame rating




Application:

?General equipment casing   

?Home appliances

?Industrial equipment    

?Notebook computer,tablet computer




Product Performance:

	Value	Standard
Base material	Conductive cloth of antioxidant(Ni-Cu-Ni)?halogen-free flame-retardant tape?PU foam
180° Peeling strength(gf/25mm)	800-1300	ASTM 1000
Surface resistance(O/Sqr)	=0.5	ASTM F 390
Contact resistance(O)	=0.5	MIL G 83528
Shielding efficiency(100MHz db)	=80
Wear resistance(times)	1,000,000
Compression set	=15%
Compression forces(ibs/.in)	1-5
Proposed compression(%)	50-80
Flammability	UL94 V-0
Halogen/RoHS/Reach	Pass
Use temperature(?)	-20~120